DISCO Corporation, with operations in North America, Europe and Asia, is a multi-billion dollar global leader in the design and manufacture of wafer dicing and grinding equipment.

For over 80 years, we have been pioneering solutions for our customers and pushing the limits of technology. We seek outstanding candidates who demonstrate a passion for excellence and who can thrive in a high-growth, fast-paced industry.

DISCO is an international company headquartered in Tokyo, Japan.